NXP Semiconductors LPC2362FBD100,551 Microcontroller, Microprocessor, FPGA Modules
IC MCU 16/32B 128KB FLSH 100LQFP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
LPC2362FBD100,551
Detailed Description
Package
100-LQFP
Key Features
Package / Case: 100-LQFP; Mounting Type: Surface Mount
Lifecycle Status
Not For New Designs
RoHS State
Compliant
Datasheet
LPC2362FBD100,551 Datasheet
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Technical Specifications
NXP Semiconductors LPC2362FBD100,551 Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
100-LQFP
Supplier Device Package
100-LQFP (14x14)
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number of I/O
70
Speed
72MHz
Core Processor
ARM7®
RAM Size
58K x 8
Program Memory Type
Flash
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