NXP Semiconductors LPC18S57JBD208E Microcontroller, Microprocessor, FPGA Modules
IC MCU 32BIT 1MB FLASH 208LQFP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
LPC18S57JBD208E
Detailed Description
Package
208-LQFP
Key Features
Package / Case: 208-LQFP; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
LPC18S57JBD208E Datasheet
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Technical Specifications
NXP Semiconductors LPC18S57JBD208E Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
-40°C ~ 105°C (TA)
Mounting Type
Surface Mount
Package / Case
208-LQFP
Supplier Device Package
208-LQFP (28x28)
Peripherals
Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Number of I/O
142
Speed
180MHz
Core Processor
ARM® Cortex®-M3
RAM Size
136K x 8
Program Memory Type
Flash
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