NXP Semiconductors LPC18S30FET256E Microcontroller, Microprocessor, FPGA Modules
IC MCU 32BIT ROMLESS 256LBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
LPC18S30FET256E
Detailed Description
Package
256-LBGA
Key Features
Package / Case: 256-LBGA; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
LPC18S30FET256E Datasheet
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Technical Specifications
NXP Semiconductors LPC18S30FET256E Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
256-LBGA
Supplier Device Package
256-LBGA (17x17)
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number of I/O
164
Speed
180MHz
Core Processor
ARM® Cortex®-M3
RAM Size
200K x 8
Program Memory Type
ROMless
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