NXP Semiconductors LPC1850FBD208,551 Microcontroller, Microprocessor, FPGA Modules
IC MCU 32BIT ROMLESS 208LQFP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
LPC1850FBD208,551
Detailed Description
Package
208-LQFP
Key Features
Package / Case: 208-LQFP; Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
Compliant
Datasheet
LPC1850FBD208,551 Datasheet
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Technical Specifications
NXP Semiconductors LPC1850FBD208,551 Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
208-LQFP
Supplier Device Package
208-LQFP (28x28)
Peripherals
Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Number of I/O
142
Speed
180MHz
Core Processor
ARM® Cortex®-M3
RAM Size
200K x 8
Program Memory Type
ROMless
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