NXP Semiconductors LPC1823JET100E Microcontroller, Microprocessor, FPGA Modules
IC MCU 32BIT 512KB FLSH 100TFBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
LPC1823JET100E
Detailed Description
Package
100-TFBGA
Key Features
Package / Case: 100-TFBGA; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
LPC1823JET100E Datasheet
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Technical Specifications
NXP Semiconductors LPC1823JET100E Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
-40°C ~ 105°C (TA)
Mounting Type
Surface Mount
Package / Case
100-TFBGA
Supplier Device Package
100-TFBGA (9x9)
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, WDT
Number of I/O
49
Speed
180MHz
EEPROM Size
16K x 8
Core Processor
ARM® Cortex®-M3
RAM Size
104K x 8
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