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NXP Semiconductors LPC1114FHI33/303,5 Microcontroller, Microprocessor, FPGA Modules

IC MCU 32BIT 32KB FLASH 32HVQFN

2,436NXP Semiconductors32-VFQFN Exposed PadRoHS
LPC1114FHI33/303,5 - No Image Available

Same model may have multiple batches, images only for reference.

LPC1114FHI33/303,5
Manufacturer
Part Number (MPN)
LPC1114FHI33/303,5
Detailed Description
Package
32-VFQFN Exposed Pad
Key Features
Package / Case: 32-VFQFN Exposed Pad; Mounting Type: Surface Mount
Lifecycle Status
Discontinued at Digi-Key
RoHS State
Compliant
Datasheet
PDF LPC1114FHI33/303,5 Datasheet
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Technical Specifications

NXP Semiconductors LPC1114FHI33/303,5 Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
32-VFQFN Exposed Pad
Supplier Device Package
32-HVQFN (5x5)
Peripherals
Brown-out Detect/Reset, POR, WDT
Number of I/O
28
Speed
50MHz
Core Processor
ARM® Cortex®-M0
RAM Size
8K x 8
Program Memory Type
Flash

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