Micron Technology Inc. NAND256W3A2BZAXE Flash Memory
IC FLASH 256MBIT PAR 55VFBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
NAND256W3A2BZAXE
Detailed Description
Package
55-VFBGA (8x10)
Key Features
Package: Tray; Package / Case: 55-TFBGA; Mounting Type: Surface Mount; Supply Voltage: 2.7V ~ 3.6V; Memory Size: 256Mbit
Lifecycle Status
Obsolete
RoHS State
Compliant
Datasheet
NAND256W3A2BZAXE Datasheet
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Technical Specifications
Micron Technology Inc. NAND256W3A2BZAXE Flash Memory technical specifications.
General
Operating Temperature
-40°C ~ 85°C (TA)
Memory Interface
Parallel
ECCN
3A991B1A
Memory Organization
32M x 8
Mounting Type
Surface Mount
Memory Type
Non-Volatile
Lifecycle Status
Obsolete
Supplier Device Package
55-VFBGA (8x10)
Access Time
50 ns
Write Cycle Time Word Page
50ns
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NAND256W3A2BZA6EMicron Technology Inc.Package: Tray | Package / Case: 55-TFBGA | Mounting Type: Surface Mount | Supply Voltage: 2.7V ~ 3.6V | Memory Size: 256Mbit | Operating Temperature: -40°C ~ 85°C (TA)
NAND256R3A2BZA6EMicron Technology Inc.Package: Tray | Package / Case: 55-TFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.7V ~ 1.95V | Memory Size: 256Mb (32M x 8) | Operating Temperature: -40°C ~ 85°C (TA)
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