Micron Technology Inc. NAND256W3A2BZA6E Flash Memory
IC FLASH 256MBIT PAR 55VFBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
NAND256W3A2BZA6E
Detailed Description
Package
55-VFBGA (8x10)
Key Features
Package: Tray; Package / Case: 55-TFBGA; Mounting Type: Surface Mount; Supply Voltage: 2.7V ~ 3.6V; Memory Size: 256Mbit
Lifecycle Status
Obsolete
RoHS State
Compliant
Datasheet
NAND256W3A2BZA6E Datasheet
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Technical Specifications
Micron Technology Inc. NAND256W3A2BZA6E Flash Memory technical specifications.
General
Operating Temperature
-40°C ~ 85°C (TA)
Inventory Source
Winsource
Inventory Source File
/Volumes/T7 Shield/电子元器件数据/抓取的数据/Win-Source数据/winsource_未曾下架数据_202605_1.xlsx
Inventory As of
2026-05-15
Source Manufacturer
Micron Technology Inc.
Source Category
Integrated Circuits (ICs) > Memory > Flash
Stock
12100
Extracted Price
6.4095
Price Formula
winsource min price * 2
Memory Interface
Parallel
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NAND256R3A2BZA6EMicron Technology Inc.Package: Tray | Package / Case: 55-TFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.7V ~ 1.95V | Memory Size: 256Mb (32M x 8) | Operating Temperature: -40°C ~ 85°C (TA)
NAND256W3A2BZAXEMicron Technology Inc.Package: Tray | Package / Case: 55-TFBGA | Mounting Type: Surface Mount | Supply Voltage: 2.7V ~ 3.6V | Memory Size: 256Mbit | Operating Temperature: -40°C ~ 85°C (TA)
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M25PE10-VMN6TPMicron Technology Inc.Package: SO | Mounting Type: Surface Mount | Supply Voltage: 3/3.3 | Memory Size: 1M | Interface: Serial-SPI | Number of Pins: 8