Micron Technology Inc. MT61K512M32KPA-24:U DRAM
GDDR6 16G 512MX32 FBGA DDP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MT61K512M32KPA-24:U
Detailed Description
Package
180-FBGA (12x14)
Key Features
Package: Box; Package / Case: 180-TFBGA; Mounting Type: Surface Mount; Supply Voltage: 1.3095V ~ 1.3905V; Memory Size: 16Gbit
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
MT61K512M32KPA-24:U Datasheet
Quick Jump:
Technical Specifications
Micron Technology Inc. MT61K512M32KPA-24:U DRAM technical specifications.
General
Fbga Marking Code
D8BZF
Inventory Source
Winsource
Inventory Source File
/Volumes/T7 Shield/电子元器件数据/抓取的数据/Win-Source数据/winsource_未曾下架数据_202605_1.xlsx
Inventory As of
2026-05-15
Source Manufacturer
Micron Technology Inc.
Source Category
Integrated Circuits (ICs) > Memory > DRAM
Stock
200
Extracted Price
116.418
Price Formula
winsource min price * 2
Max Frequency
12 GHz
More in This Category
Browse related parts from the same category — sorted by series, manufacturer, and package similarity. These are not verified pin-to-pin substitutes.
MT61K512M32KPA-14C:BMicron Technology Inc.Package: Tray | Package / Case: 180-TFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.31V ~ 1.391V | Memory Size: 16Gbit | Operating Temperature: 0°C ~ 95°C (TC)
MT61K512M32KPA-14:BMicron Technology Inc.Package: Tray | Package / Case: 180-TFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.31V ~ 1.391V | Memory Size: 16Gbit | Operating Temperature: 0°C ~ 95°C (TC)
MT61K512M32KPA-14:CMicron Technology Inc.Package: Box | Package / Case: 180-TFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.3095V ~ 1.3905V | Memory Size: 16Gbit | Operating Temperature: 0°C ~ 95°C (TC) | Organization: 512 M x 32
MT61K512M32KPA-21:UMicron Technology Inc.Package: Box | Package / Case: 180-TFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.3095V ~ 1.3905V | Memory Size: 16Gbit | Operating Temperature: 0°C ~ 95°C (TC) | Organization: 512 M x 32