Micron Technology Inc. MT61K512M32KPA-18:E DRAM
GDDR6 16GBIT 32 180/252 TFBGA 2
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MT61K512M32KPA-18:E
Detailed Description
Package
180-FBGA (12x14)
Key Features
Package: Tray; Package / Case: 180-TFBGA; Mounting Type: Surface Mount; Supply Voltage: 1.3095V ~ 1.391V; Memory Size: 16Gbit
Lifecycle Status
Active
RoHS State
Unknown
Datasheet
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Technical Specifications
Micron Technology Inc. MT61K512M32KPA-18:E DRAM technical specifications.
General
Fbga Marking Code
D8DZK
Max Frequency
9 GHz
Operating Temperature
0°C ~ 95°C (TC)
Memory Interface
POD_135
HTS
EA
Memory Organization
512M x 32
Mounting Type
Surface Mount
Memory Type
Volatile
Lifecycle Status
Active
Supplier Device Package
180-FBGA (12x14)
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MT61K512M32KPA-14C:BMicron Technology Inc.Package: Tray | Package / Case: 180-TFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.31V ~ 1.391V | Memory Size: 16Gbit | Operating Temperature: 0°C ~ 95°C (TC)
MT61K512M32KPA-14:BMicron Technology Inc.Package: Tray | Package / Case: 180-TFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.31V ~ 1.391V | Memory Size: 16Gbit | Operating Temperature: 0°C ~ 95°C (TC)
MT61K512M32KPA-14:CMicron Technology Inc.Package: Box | Package / Case: 180-TFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.3095V ~ 1.3905V | Memory Size: 16Gbit | Operating Temperature: 0°C ~ 95°C (TC) | Organization: 512 M x 32
MT61K512M32KPA-24:UMicron Technology Inc.Package: Box | Package / Case: 180-TFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.3095V ~ 1.3905V | Memory Size: 16Gbit | Operating Temperature: 0°C ~ 95°C (TC) | Organization: 512 M x 32