Micron Technology Inc. MT57W512H36JF-7.5 SRAM
IC SRAM 18MBIT HSTL 165FBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MT57W512H36JF-7.5
Detailed Description
Package
165-FBGA (13x15)
Key Features
Package: Bulk; Package / Case: 165-TBGA; Mounting Type: Surface Mount; Supply Voltage: 1.7V ~ 1.9V; Memory Size: 18Mbit
Lifecycle Status
Active
RoHS State
RoHS non-compliant
Datasheet
MT57W512H36JF-7.5 Datasheet
Quick Jump:
Technical Specifications
Micron Technology Inc. MT57W512H36JF-7.5 SRAM technical specifications.
General
Fbga Marking Code
SLPPK
Max Frequency
133 MHz
Operating Temperature
0°C ~ 70°C (TA)
Memory Interface
HSTL
ECCN
3A991B2A
Memory Organization
512K x 36
Mounting Type
Surface Mount
Memory Type
Volatile
Lifecycle Status
Active
Supplier Device Package
165-FBGA (13x15)
More in This Category
Browse related parts from the same category — sorted by series, manufacturer, and package similarity. These are not verified pin-to-pin substitutes.
MT54V512H18AF-7.5Micron Technology Inc.Package: Bulk | Package / Case: 165-TBGA | Mounting Type: Surface Mount | Supply Voltage: 2.4V ~ 2.6V | Memory Size: 9Mbit | Operating Temperature: -20°C ~ 110°C (TJ)
MT57W512H36JF-6Micron Technology Inc.Package: Bulk | Package / Case: 165-TBGA | Mounting Type: Surface Mount | Supply Voltage: 1.7V ~ 1.9V | Memory Size: 18Mbit | Operating Temperature: 0°C ~ 70°C (TA)
MT55L512Y36PF-10Micron Technology Inc.Package: Bulk | Package / Case: 165-TBGA | Mounting Type: Surface Mount | Supply Voltage: 3.135V ~ 3.465V | Memory Size: 18Mbit | Operating Temperature: 0°C ~ 70°C (TA)
MT54V512H18EF-6Micron Technology Inc.Package: Bulk | Package / Case: 165-TBGA | Mounting Type: Surface Mount | Supply Voltage: 2.4V ~ 2.6V | Memory Size: 9Mbit | Operating Temperature: 0°C ~ 70°C (TA)