Micron Technology Inc. MT53E512M32D1Z42MWC1 DRAM
LPDDR4 16G DIE 512MX32
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MT53E512M32D1Z42MWC1
Detailed Description
Package
Wafer
Key Features
Package: Box; Package / Case: Die; Mounting Type: Surface Mount; Memory Size: 16Gbit
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
MT53E512M32D1Z42MWC1 Datasheet
Quick Jump:
Technical Specifications
Micron Technology Inc. MT53E512M32D1Z42MWC1 DRAM technical specifications.
General
Memory Interface
Parallel
Memory Organization
512M x 32
Mounting Type
Surface Mount
Memory Type
Volatile
Lifecycle Status
Active
Supplier Device Package
Wafer
Memory Size
16Gbit
Package / Case
Die
Technology
SDRAM - Mobile LPDDR4X
Reach Status
REACH Unaffected
More in This Category
Browse related parts from the same category — sorted by series, manufacturer, and package similarity. These are not verified pin-to-pin substitutes.
MT40A1G8Z11BWC1Micron Technology Inc.Package: Tray | Package / Case: Die | Mounting Type: Surface Mount | Supply Voltage: 1.14V ~ 1.26V | Memory Size: 8Gbit
MT40A1G8Z01AWC1Micron Technology Inc.Package: Bulk | Package / Case: Die | Mounting Type: Surface Mount | Supply Voltage: 1.14V ~ 1.26V | Memory Size: 8Gbit
MT40A512M16Z01AWC1Micron Technology Inc.Package: Bulk | Package / Case: Die | Mounting Type: Surface Mount | Supply Voltage: 1.14V ~ 1.26V | Memory Size: 8Gbit
MT40A512M16Z11BWC1Micron Technology Inc.Package: Tray | Package / Case: Die | Mounting Type: Surface Mount | Supply Voltage: 1.14V ~ 1.26V | Memory Size: 8Gbit