Micron Technology Inc. MT29F2G08ABBGAH4-AAT:G Flash Memory
IC FLASH 2GBIT PARALLEL 63VFBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MT29F2G08ABBGAH4-AAT:G
Detailed Description
Package
63-VFBGA (9x11)
Key Features
Package: Bulk; Package / Case: 63-VFBGA; Mounting Type: Surface Mount; Supply Voltage: 1.7V ~ 1.95V; Memory Size: 2G; Interface: Parallel
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
Quick Jump:
Technical Specifications
Micron Technology Inc. MT29F2G08ABBGAH4-AAT:G Flash Memory technical specifications.
General
Fbga Marking Code
NX014
HTS
8542.32.00.71
ECCN
3A991b.1.a.
Memory Type
Non-Volatile
Lifecycle Status
Active
Supplier Device Package
63-VFBGA (9x11)
Automotive
Yes
Min Operating Temp
-40
Max Operating Temp
105
Access Time
30 ns
More in This Category
Browse related parts from the same category — sorted by series, manufacturer, and package similarity. These are not verified pin-to-pin substitutes.
MT29F1G08ABAEAH4:EMicron Technology Inc.Package: Bulk | Package / Case: 63-VFBGA | Mounting Type: Surface Mount | Supply Voltage: 2.7V ~ 3.6V | Memory Size: 1Gbit | Interface: Parallel | Operating Temperature: 0°C ~ 70°C (TA) | Organization: 128 M x 8
NAND512R3A2SZA6EMicron Technology Inc.Package: Tray | Package / Case: 63-TFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.7V ~ 1.95V | Memory Size: 512Mbit | Interface: Parallel | Operating Temperature: -40°C ~ 85°C (TA) | Number of Pins: 63
MT29F1G08ABAEAH4-IT:EMicron Technology Inc.Package: Bulk | Package / Case: 63-VFBGA | Mounting Type: Surface Mount | Supply Voltage: 2.7V ~ 3.6V | Memory Size: 1Gbit | Operating Temperature: -40°C ~ 85°C (TA)
NAND512R3A2DZA6EMicron Technology Inc.Package: Tray | Package / Case: 63-TFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.7V ~ 1.95V | Memory Size: 512Mbit | Operating Temperature: -40°C ~ 85°C (TA)