Micron Technology Inc. MT29F128G08CBCEBL05B3WC1-M Flash Memory
IC FLASH 128GBIT PARALLEL DIE

Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MT29F128G08CBCEBL05B3WC1-M
Detailed Description
Package
Die
Key Features
Package: Bulk; Package / Case: Die; Mounting Type: Surface Mount; Supply Voltage: 2.7V ~ 3.6V; Memory Size: 128G; Interface: Parallel
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
MT29F128G08CBCEBL05B3WC1-M Datasheet
Quick Jump:
Technical Specifications
Micron Technology Inc. MT29F128G08CBCEBL05B3WC1-M Flash Memory technical specifications.
General
HTS
8542.32.00.51
Memory Type
Non-Volatile
Lifecycle Status
Active
Supplier Device Package
Die
Memory Size
128G
Package / Case
Die
Technology
FLASH - NAND
Supply Voltage
2.7V ~ 3.6V
Reach Status
REACH Unaffected
Mfr
Micron Technology Inc.
More in This Category
Browse related parts from the same category — sorted by series, manufacturer, and package similarity. These are not verified pin-to-pin substitutes.
MT29F4G08ABAEAM70M3WC1Micron Technology Inc.Package: Bulk | Package / Case: Die | Mounting Type: Surface Mount | Supply Voltage: 2.7V ~ 3.6V | Memory Size: 4Gbit | Operating Temperature: 0°C ~ 70°C (TA)
MT29F16G08ABCBBM62B3WC1Micron Technology Inc.Package: Bulk | Package / Case: Die | Mounting Type: Surface Mount | Supply Voltage: 2.7V ~ 3.6V | Memory Size: 16Gbit | Operating Temperature: 0°C ~ 70°C (TA)
MT29F32G08CBACAL73A3WC1PMicron Technology Inc.Package: Bulk | Package / Case: Die | Mounting Type: Surface Mount | Supply Voltage: 2.7V ~ 3.6V | Memory Size: 32Gbit | Operating Temperature: 0°C ~ 70°C (TA)
MT29F2G08ABAGAM79A3WC1LMicron Technology Inc.Package: Bulk | Package / Case: Die | Mounting Type: Surface Mount | Supply Voltage: 2.7V ~ 3.6V | Memory Size: 2Gbit | Operating Temperature: 0°C ~ 70°C (TA)