Micron Technology Inc. EDFM432A1PH-GD-F-R DRAM
DRAM Chip Mobile LPDDR3 SDRAM 12Gbit 384Mx32 1.2V 168-Pin VFBGA T/R
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
EDFM432A1PH-GD-F-R
Detailed Description
Package
BGA
Key Features
Package: BGA; Mounting Type: Surface Mount; Memory Size: 12G
Lifecycle Status
Obsolete
RoHS State
Compliant
Datasheet
EDFM432A1PH-GD-F-R Datasheet
Quick Jump:
Technical Specifications
Micron Technology Inc. EDFM432A1PH-GD-F-R DRAM technical specifications.
General
Number of Bits Word Bit
32
Number of IO Lines Bit
32
Organization
384Mx32
HTS
COMPONENTS
ECCN
EAR99
Ppap
No
Data Bus Width Bit
32
Package
BGA
Automotive
No
Number of Pins
168
More in This Category
Browse related parts from the same category — sorted by series, manufacturer, and package similarity. These are not verified pin-to-pin substitutes.
MT44K32M36RB-107E:AMicron Technology Inc.Package: BGA | Package / Case: 168-TBGA | Mounting Type: Surface Mount | Supply Voltage: 1.28V ~ 1.42V | Memory Size: 1.125G | Operating Temperature: 0°C ~ 95°C (TC) | Number of Pins: 168 | Organization: 32Mx36
MT61K256M32JE-19G:TMicron Technology Inc.Package: BGA | Mounting Type: Surface Mount | Number of Pins: 180 | Fbga Marking Code: D8BWW | Number of Bits Word Bit: 32 | HTS: 8542.32.00.32
MT44K64M18RB-093E:AMicron Technology Inc.Package: BGA | Package / Case: 168-TBGA | Mounting Type: Surface Mount | Supply Voltage: 1.28V ~ 1.42V | Memory Size: 1.125G | Operating Temperature: 0°C ~ 95°C (TC) | Number of Pins: 168 | Organization: 64Mx18
MT44K32M36RB-093E:AMicron Technology Inc.Package: BGA | Package / Case: 168-TBGA | Mounting Type: Surface Mount | Supply Voltage: 1.28V ~ 1.42V | Memory Size: 1.125G | Operating Temperature: 0°C ~ 95°C (TC) | Number of Pins: 168 | Organization: 32Mx36