Micron Technology Inc. EDB8164B4PT-1D-F-D DRAM
IC DRAM 8GBIT PAR 216FBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
EDB8164B4PT-1D-F-D
Detailed Description
Package
216-FBGA (12x12)
Key Features
Package: Bulk; Package / Case: 216-WFBGA; Mounting Type: Surface Mount; Supply Voltage: 1.14V ~ 1.95V; Memory Size: 8Gbit
Lifecycle Status
Obsolete
RoHS State
Compliant
Datasheet
EDB8164B4PT-1D-F-D Datasheet
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Technical Specifications
Micron Technology Inc. EDB8164B4PT-1D-F-D DRAM technical specifications.
General
Fbga Marking Code
D9XCS
Max Frequency
533 MHz
Operating Temperature
-30°C ~ 85°C (TC)
Memory Interface
Parallel
ECCN
EAR99
Memory Organization
128M x 64
Mounting Type
Surface Mount
Memory Type
Volatile
Lifecycle Status
Obsolete
Supplier Device Package
216-FBGA (12x12)
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EDB8164B4PR-1D-F-DMicron Technology Inc.Package: Tray | Package / Case: 216-WFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.14V ~ 1.95V | Memory Size: 8Gbit | Operating Temperature: -30°C ~ 85°C (TC)
EDB8164B4PT-1DAT-F-DMicron Technology Inc.Package: Tray | Package / Case: 216-WFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.14V ~ 1.95V | Memory Size: 8Gbit | Operating Temperature: -40°C ~ 105°C (TC)
EDB8164B4PT-1DAT-F-RMicron Technology Inc.Package: Tape & Reel (TR) | Package / Case: 216-WFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.14V ~ 1.95V | Memory Size: 8Gbit | Operating Temperature: -40°C ~ 105°C (TC)
EDF8164A3PK-JD-F-RMicron Technology Inc.Package: Tape & Reel (TR) | Package / Case: 216-WFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.14V ~ 1.95V | Memory Size: 8Gbit | Operating Temperature: -30°C ~ 85°C (TC)