Microchip Technology PIC16CE625-30/P Microcontroller, Microprocessor, FPGA Modules
IC MCU 8BIT 3.5KB OTP 18DIP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
PIC16CE625-30/P
Detailed Description
Package
18-DIP (0.300", 7.62mm)
Key Features
Package / Case: 18-DIP (0.300", 7.62mm); Mounting Type: Through Hole
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
PIC16CE625-30/P Datasheet
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Technical Specifications
Microchip Technology PIC16CE625-30/P Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
0°C ~ 70°C (TA)
Mounting Type
Through Hole
Package / Case
18-DIP (0.300", 7.62mm)
Supplier Device Package
18-PDIP
Peripherals
Brown-out Detect/Reset, POR, WDT
Number of I/O
13
Speed
30MHz
EEPROM Size
128 x 8
Core Processor
PIC
RAM Size
128 x 8
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