Microchip Technology PCX755BVZFU350LE Microcontroller, Microprocessor, FPGA Modules
IC MPU POWERPC 350MHZ 360BGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
PCX755BVZFU350LE
Detailed Description
Package
360-BBGA Exposed Pad
Key Features
Package / Case: 360-BBGA Exposed Pad
Lifecycle Status
Obsolete
RoHS State
Compliant
Datasheet
PCX755BVZFU350LE Datasheet
Quick Jump:
Technical Specifications
Microchip Technology PCX755BVZFU350LE Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
-40°C ~ 110°C (TJ)
Package / Case
360-BBGA Exposed Pad
Supplier Device Package
360-PBGA (25x25)
Voltage IO
2.5V, 3.3V
Speed
350MHz
Core Processor
PowerPC
Number of Cores Bus Width
1 Core, 32-Bit
Graphics Acceleration
No
More in This Category
Browse related parts from the same category — sorted by series, manufacturer, and package similarity. These are not verified pin-to-pin substitutes.
