Microchip Technology MEC1609I-PZP Microcontroller, Microprocessor, FPGA Modules
MIXED SIGNAL MOBILE EMBEDDED CON
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MEC1609I-PZP
Detailed Description
Package
144-LFBGA
Key Features
Package / Case: 144-LFBGA; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
MEC1609I-PZP Datasheet
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Technical Specifications
Microchip Technology MEC1609I-PZP Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
144-LFBGA
Interface
ACPI, BC-Link, I²C/SMBus, LPC, PECI, PS/2, SPI, VLPC
Supplier Device Package
144-LFBGA (10x10)
Supply Voltage
3.3V
Number of I/O
115
Core Processor
ARC-625D
RAM Size
16kB
Program Memory Type
FLASH (192kB)
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