Microchip Technology DSPIC30F3013-20I/SP Microcontroller, Microprocessor, FPGA Modules
IC MCU 16BIT 24KB FLASH 28SPDIP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
DSPIC30F3013-20I/SP
Detailed Description
Package
28-DIP (0.300", 7.62mm)
Key Features
Package / Case: 28-DIP (0.300", 7.62mm); Mounting Type: Through Hole
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
DSPIC30F3013-20I/SP Datasheet
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Technical Specifications
Microchip Technology DSPIC30F3013-20I/SP Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Through Hole
Package / Case
28-DIP (0.300", 7.62mm)
Supplier Device Package
28-SPDIP
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O
20
Speed
20 MIPS
EEPROM Size
1K x 8
Core Processor
dsPIC
RAM Size
2K x 8
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