ISSI® IS61NLP25636B-200B3LI SRAM
IC SRAM 9MBIT PARALLEL 165TFBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
IS61NLP25636B-200B3LI
Detailed Description
Package
165-TFBGA (13x15)
Key Features
Package: BGA; Package / Case: 165-TBGA; Mounting Type: Surface Mount; Supply Voltage: 3.135V ~ 3.465V; Memory Size: 8M; Interface: Parallel
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
IS61NLP25636B-200B3LI Datasheet
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Technical Specifications
ISSI® IS61NLP25636B-200B3LI SRAM technical specifications.
General
Max Frequency
200 MHz
HTS
8542.32.00.41
ECCN
3A991b.2.a.
Ppap
No
Memory Type
Volatile
Lifecycle Status
Active
Supplier Device Package
165-TFBGA (13x15)
Automotive
No
Address Bus Width Bit
19
Supplier Package
TFBGA
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IS61LPS25636A-200B3I-TRISSI®Package: Tape & Reel (TR) | Package / Case: 165-TBGA | Mounting Type: Surface Mount | Supply Voltage: 3.135V ~ 3.465V | Memory Size: 9Mbit | Operating Temperature: -40°C ~ 85°C (TA)
IS61NLP102418-200B3LI-TRISSI®Package: Tape & Reel (TR) | Package / Case: 165-TBGA | Mounting Type: Surface Mount | Supply Voltage: 3.135V ~ 3.465V | Memory Size: 18Mbit | Data Rate: SDR | Operating Temperature: -40°C ~ 85°C (TA)
IS61NLF51236-6.5B3ISSI®Package: Tray | Package / Case: 165-TBGA | Mounting Type: Surface Mount | Supply Voltage: 3.135V ~ 3.465V | Memory Size: 18Mbit | Operating Temperature: 0°C ~ 70°C (TA)
IS61LPS25636A-200B3IISSI®Package: Tray | Package / Case: 165-TBGA | Mounting Type: Surface Mount | Supply Voltage: 3.135V ~ 3.465V | Memory Size: 9Mbit | Operating Temperature: -40°C ~ 85°C (TA)