ISSI® IS25WP128-RHLE Flash Memory
IC FLASH 128MBIT SPI 24TFBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
IS25WP128-RHLE
Detailed Description
Package
BGA
Key Features
Package: BGA; Mounting Type: Surface Mount; Supply Voltage: 1.8; Memory Size: 128M; Interface: Serial (SPI, Dual SPI, Quad SPI)
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
Quick Jump:
Technical Specifications
ISSI® IS25WP128-RHLE Flash Memory technical specifications.
General
RoHS
Compliant
ECCN
3A991.b.1.a
Lifecycle Status
Active
HTS
8542.32.00.71
Automotive
Yes
Ppap
Yes
Cell Type
NOR
Memory Size
128M
Architecture
Sectored
Boot Block
Yes
More in This Category
Browse related parts from the same category — sorted by series, manufacturer, and package similarity. These are not verified pin-to-pin substitutes.
IS25LP256D-RHLE-TRISSI®Package: BGA | Package / Case: 24-TBGA | Mounting Type: Surface Mount | Supply Voltage: 2.5/3/3.3 | Memory Size: 256M | Interface: Serial (SPI, Dual SPI, Quad SPI) | Operating Temperature: -40°C ~ 105°C (TA) | Number of Pins: 24
IS25LP512M-RHLEISSI®Package: BGA | Package / Case: 24-TBGA | Mounting Type: Surface Mount | Supply Voltage: 2.5/3/3.3 | Memory Size: 512M | Interface: Serial (SPI, Dual SPI, Quad SPI) | Operating Temperature: -40°C ~ 105°C (TA) | Number of Pins: 24
IS25LP512M-RHLE-TRISSI®Package: BGA | Package / Case: 24-TBGA | Mounting Type: Surface Mount | Supply Voltage: 2.5/3/3.3 | Memory Size: 512M | Interface: Serial (SPI, Dual SPI, Quad SPI) | Operating Temperature: -40°C ~ 105°C (TA) | Number of Pins: 24
IS29GL256-70DLEBISSI®Package: BGA | Package / Case: 64-LBGA | Mounting Type: Surface Mount | Supply Voltage: 3/3.3 | Memory Size: 256M | Interface: Parallel | Operating Temperature: -40°C ~ 105°C (TA) | Number of Pins: 64