ISSI® IS25LE01G-RILE Flash Memory
IC FLASH 1GBIT SPI/QUAD 24LFBGA

Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
IS25LE01G-RILE
Detailed Description
Package
BGA
Key Features
Package: BGA; Package / Case: 24-LBGA; Mounting Type: Surface Mount; Supply Voltage: 3/3.3; Memory Size: 1G; Interface: Serial (SPI, Dual SPI, Quad SPI)
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
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Technical Specifications
ISSI® IS25LE01G-RILE Flash Memory technical specifications.
General
RoHS
Compliant
ECCN
3A991.b.1.a
Lifecycle Status
Active
HTS
8542.32.00.71
Automotive
No
Ppap
No
Cell Type
NOR
Memory Size
1G
Architecture
Sectored
Boot Block
Yes
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Package: BGA | Package / Case: 24-TBGA | Mounting Type: Surface Mount | Supply Voltage: 2.5/3/3.3 | Memory Size: 256M | Interface: Serial (SPI, Dual SPI, Quad SPI) | Operating Temperature: -40°C ~ 105°C (TA) | Number of Pins: 24
Package: BGA | Package / Case: 24-TBGA | Mounting Type: Surface Mount | Supply Voltage: 2.5/3/3.3 | Memory Size: 512M | Interface: Serial (SPI, Dual SPI, Quad SPI) | Operating Temperature: -40°C ~ 105°C (TA) | Number of Pins: 24
Package: BGA | Package / Case: 24-TBGA | Mounting Type: Surface Mount | Supply Voltage: 2.5/3/3.3 | Memory Size: 512M | Interface: Serial (SPI, Dual SPI, Quad SPI) | Operating Temperature: -40°C ~ 105°C (TA) | Number of Pins: 24
Package: BGA | Package / Case: 64-LBGA | Mounting Type: Surface Mount | Supply Voltage: 3/3.3 | Memory Size: 256M | Interface: Parallel | Operating Temperature: -40°C ~ 105°C (TA) | Number of Pins: 64