Infineon Technologies XC2263M72F80LRABKXUMA1 Microcontroller, Microprocessor, FPGA Modules
16 BIT FLASH C11 BCS
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
XC2263M72F80LRABKXUMA1
Detailed Description
Package
100-LQFP Exposed Pad
Key Features
Package / Case: 100-LQFP Exposed Pad; Mounting Type: Surface Mount
Lifecycle Status
Not For New Designs
RoHS State
Compliant
Datasheet
XC2263M72F80LRABKXUMA1 Datasheet
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Technical Specifications
Infineon Technologies XC2263M72F80LRABKXUMA1 Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
-40°C ~ 125°C (TA)
Mounting Type
Surface Mount
Package / Case
100-LQFP Exposed Pad
Supplier Device Package
PG-LQFP-100-8
Peripherals
I²S, POR, PWM, WDT
Number of I/O
76
Speed
80MHz
Core Processor
C166SV2
RAM Size
50K x 8
Program Memory Type
Flash
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