Infineon Technologies TC275TP64F200WDBKXUMA1 Microcontroller, Microprocessor, FPGA Modules
IC MICROCONTROLLER
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
TC275TP64F200WDBKXUMA1
Detailed Description
Package
176-LQFP Exposed Pad
Key Features
Package / Case: 176-LQFP Exposed Pad; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
TC275TP64F200WDBKXUMA1 Datasheet
Quick Jump:
Technical Specifications
Infineon Technologies TC275TP64F200WDBKXUMA1 Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
-40°C ~ 125°C (TA)
Mounting Type
Surface Mount
Package / Case
176-LQFP Exposed Pad
Supplier Device Package
PG-LQFP-176-22
Peripherals
DMA, POR, WDT
Number of I/O
169
Speed
200MHz
EEPROM Size
64K x 8
Core Processor
TriCore™
RAM Size
472K x 8
More in This Category
Browse related parts from the same category — sorted by series, manufacturer, and package similarity. These are not verified pin-to-pin substitutes.