Infineon Technologies S6J334CJTESE20000 Microcontroller, Microprocessor, FPGA Modules
IC MCU 32BT 2.0625MB FLSH 176QFP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
S6J334CJTESE20000
Detailed Description
Package
176-LQFP Exposed Pad
Key Features
Package / Case: 176-LQFP Exposed Pad; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
S6J334CJTESE20000 Datasheet
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Technical Specifications
Infineon Technologies S6J334CJTESE20000 Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
-40°C ~ 105°C (TA)
Mounting Type
Surface Mount
Package / Case
176-LQFP Exposed Pad
Supplier Device Package
176-TEQFP (24x24)
Peripherals
DMA, I²S, LVD, POR, PWM, WDT
Number of I/O
150
Speed
240MHz
EEPROM Size
112K x 8
Core Processor
Arm® Cortex®-R5F
RAM Size
544K x 8
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