Infineon Technologies S6J32JEKSNSE20000 Microcontroller, Microprocessor, FPGA Modules
IC MCU 32B 4.171875MB FL 208QFP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
S6J32JEKSNSE20000
Detailed Description
Package
208-LQFP Exposed Pad
Key Features
Package / Case: 208-LQFP Exposed Pad; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
S6J32JEKSNSE20000 Datasheet
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Technical Specifications
Infineon Technologies S6J32JEKSNSE20000 Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
-40°C ~ 105°C (TA)
Mounting Type
Surface Mount
Package / Case
208-LQFP Exposed Pad
Supplier Device Package
208-TEQFP (28x28)
Peripherals
DMA, I²S, LVD, POR, PWM, WDT
Number of I/O
120
Speed
240MHz
Core Processor
Arm® Cortex®-R5F
RAM Size
2.125M x 8
Program Memory Type
Flash
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