Infineon Technologies CYT3BB8CEBQ0AESGST Microcontroller, Microprocessor, FPGA Modules
IC MCU 32BT 4.0625MB FLSH 176QFP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
CYT3BB8CEBQ0AESGST
Detailed Description
Package
176-LQFP Exposed Pad
Key Features
Package / Case: 176-LQFP Exposed Pad; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
CYT3BB8CEBQ0AESGST Datasheet
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Technical Specifications
Infineon Technologies CYT3BB8CEBQ0AESGST Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
-40°C ~ 105°C (TA)
Mounting Type
Surface Mount
Package / Case
176-LQFP Exposed Pad
Supplier Device Package
176-TEQFP (24x24)
Peripherals
Brown-out Detect/Reset, DMA, I²S, LVD, POR, PWM, WDT
Number of I/O
148
Speed
100MHz, 250MHz
EEPROM Size
256K x 8
Core Processor
ARM® Cortex®-M0+, ARM® Cortex®-M7
RAM Size
768K x 8
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