Infineon Technologies CY7C1370KV33-167BZXC SRAM
IC SRAM 18MBIT PAR 165FBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
CY7C1370KV33-167BZXC
Detailed Description
Package
BGA
Key Features
Package: BGA; Package / Case: 165-LBGA; Mounting Type: Surface Mount; Supply Voltage: 3.3; Memory Size: 18M
Lifecycle Status
Obsolete
RoHS State
Compliant
Datasheet
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Technical Specifications
Infineon Technologies CY7C1370KV33-167BZXC SRAM technical specifications.
General
RoHS
Compliant
ECCN
3A991b.2.b.
Lifecycle Status
Obsolete
HTS
8542.32.00.41
Automotive
No
Ppap
No
Memory Size
18M
Number of Words
512K
Number of Bits Word Bit
36
Architecture
Pipelined
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