Analog Devices MAXQ610X-2023+ Microcontroller, Microprocessor, FPGA Modules
IC MCU 16BIT 64KB FLASH DIE
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MAXQ610X-2023+
Detailed Description
Package
Die
Key Features
Package / Case: Die; Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
Compliant
Datasheet
MAXQ610X-2023+ Datasheet
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Technical Specifications
Analog Devices MAXQ610X-2023+ Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
0°C ~ 70°C (TA)
Mounting Type
Surface Mount
Package / Case
Die
Supplier Device Package
Die
Peripherals
Brown-out Detect/Reset, Infrared, Power-Fail, POR, WDT
Number of I/O
32
Speed
12MHz
Core Processor
MAXQ
RAM Size
2K x 8
Program Memory Type
Flash
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