Memory ICs
Memory ICs store data, firmware, and configuration information in electronic systems — from volatile SRAM and DRAM that hold active program data to non-volatile Flash, EEPROM, and FRAM that retain information through power cycles. Octatronics indexes memory ICs from Micron, Samsung, Winbond, Macronix, ISSI, Alliance Memory, Microchip, and Infineon.
Explore Memory ICs Subcategories
Configuration PROMs for FPGAs
Browse Configuration PROMs for FPGAs parts, compare product counts, and review available options for Memory ICs sourcing.
282 PartsMemory Controllers
Browse Memory Controllers parts, compare product counts, and review available options for Memory ICs sourcing.
50 PartsDRAM
Browse DRAM parts, compare product counts, and review available options for Memory ICs sourcing.
6,150 PartsEEPROM
Browse EEPROM parts, compare product counts, and review available options for Memory ICs sourcing.
9,008 PartsFlash Memory
Browse Flash Memory parts, compare product counts, and review available options for Memory ICs sourcing.
12,467 PartsSRAM
Browse SRAM parts, compare product counts, and review available options for Memory ICs sourcing.
15,448 PartsNV RAM (FRAM, MRAM, nvSRAM)
Browse NV RAM (FRAM, MRAM, nvSRAM) parts, compare product counts, and review available options for Memory ICs sourcing.
1,549 PartsEPROM
Browse EPROM parts, compare product counts, and review available options for Memory ICs sourcing.
1,185 PartsBrowse Memory ICs Products
| PART NUMBER | MANUFACTURER | DESCRIPTION | STOCK | QTY / ACTION |
|---|---|---|---|---|
| IS24C02-3ZI | ISSI® | Package: TSSOP | Memory Size: 256 B | Interface: 2-Wire | Max Frequency: 400 kHz | Max Operating Temp: 85 °C | Min Operating Temp: -40 °C | In Stock | |
| IS93C66A-2GRLI-TR | ISSI® | Package: SOIC | Memory Size: 512 B | Interface: 2-Wire | Max Frequency: 1 MHz | Max Operating Temp: 85 °C | Min Operating Temp: -40 °C | 8,000 | |
| S99GL128S0010 | Infineon Technologies | Package: Tray | MSL Level: 1 (Unlimited) | Reach Status: REACH Unaffected | ECCN: OBSOLETE | HTSUS: 0000.00.0000 | Lifecycle Status: Obsolete | In Stock | |
| CG8205AAT | Infineon Technologies | Package: Bulk | Reach Status: REACH Unaffected | ECCN: OBSOLETE | HTSUS: 0000.00.0000 | Lifecycle Status: Obsolete | Programmable: Not Verified | In Stock | |
| IS41LV16105B-60TL | ISSI® | Package: Tray | Package / Case: 44-TSOP (0.400", 10.16mm Width) | Mounting Type: SMD (SMT) | Supply Voltage: 3V ~ 3.6V | Memory Size: 16Mb (1M x 16) | Operating Temperature: 0°C ~ 70°C (TA) | 9,800 | |
| S29AL016J70BFI020A | Infineon Technologies | Package: Tray | MSL Level: 3 (168 Hours) | ECCN: OBSOLETE | Lifecycle Status: Obsolete | Programmable: Not Verified | Standard Package: 1 pcs | 31,110 | |
| CR231-80027 | Infineon Technologies | Package: Tray | MSL Level: 1 (Unlimited) | Reach Status: REACH Unaffected | ECCN: OBSOLETE | HTSUS: 0000.00.0000 | Lifecycle Status: Obsolete | In Stock | |
| CB867-80053 | Infineon Technologies | Package: Tray | MSL Level: 1 (Unlimited) | Reach Status: REACH Unaffected | ECCN: OBSOLETE | HTSUS: 0000.00.0000 | Lifecycle Status: Obsolete | In Stock | |
| AT27C512R25JI | Microchip Technology | Package: PLCC | Mounting Type: SMD (SMT) | RoHS: Compliant | In Stock | |
| AT27C010-15KC | Microchip Technology | Supply Voltage: 5 V | Number of Pins: 32 | Min Operating Temp: 0 °C | Access Time: 150 ns | Max Operating Temp: 70 °C | Density: 1 Mb | In Stock |
How to Choose Memory ICs
A practical selection framework for Memory ICs covering specifications, packaging, lifecycle, and sourcing on Octatronics.
Define electrical and environmental requirements
Start with the required function and operating conditions for Memory ICs, then lock in critical parameters such as function, supply voltage, interface, package, and temperature grade. Match these against datasheet limits, not catalog summaries alone.
Validate package and land pattern compatibility
Confirm the Memory ICs package matches your PCB footprint, pick-and-place constraints, and moisture sensitivity handling. Verify reel/tape or tube packaging for production.
Check lifecycle, compliance, and alternates
Review lifecycle status (Active, NRND, EOL), RoHS, and approved alternate sources for Memory ICs before committing to high-volume builds. Use Octatronics cross-reference data when a drop-in replacement is needed.
Compare manufacturers and request pricing
Filter Memory ICs by manufacturers such as onsemi and ROHM, compare key specs side by side, then submit an RFQ with quantity, target delivery, and traceability requirements.
Related Selection Resources
Top Memory ICs Manufacturers
onsemi
onsemi Memory ICs products are available for part-number review, stock checks, and RFQ support.
28,226 productsROHM
ROHM Memory ICs products are available for part-number review, stock checks, and RFQ support.
3,980 products
Nexperia
Nexperia Memory ICs products are available for part-number review, stock checks, and RFQ support.
3,317 productsRenesas
Renesas Memory ICs products are available for part-number review, stock checks, and RFQ support.
74,605 productsAMD/Xilinx
AMD/Xilinx Memory ICs products are available for part-number review, stock checks, and RFQ support.
1,181 productsToshiba
Toshiba Memory ICs products are available for part-number review, stock checks, and RFQ support.
63 productsWinbond Electronics
Winbond Electronics Memory ICs products are available for part-number review, stock checks, and RFQ support.
1,681 productsISSI®
ISSI® Memory ICs products are available for part-number review, stock checks, and RFQ support.
5,109 productsAlliance Memory
Alliance Memory Memory ICs products are available for part-number review, stock checks, and RFQ support.
1,536 productsMacronix
Macronix Memory ICs products are available for part-number review, stock checks, and RFQ support.
927 productsAbout Memory ICs
Frequently Asked Questions
Octatronics can help source a wide range of Memory ICs from major manufacturers worldwide, including active production parts, long-lead-time items, and hard-to-find components.
Yes. You can submit a single part number or upload a BOM with multiple parts. Our team will check stock, date code, lead time, and pricing for each item.
Availability depends on the specific part number and supplier source. For important orders, buyers can request packaging photos, labels, date code information, and traceability documents.
Yes. Octatronics supports sourcing for active, end-of-life, obsolete, and hard-to-find components through our global supplier network.
Please provide the part number, manufacturer, quantity, required date code, target price, delivery country, and whether original packaging or COC is required.
Articles & Technology
View All →
How to Choose Electronic Components for Reliable Hardware Design
Learn how to choose electronic components for reliable hardware design, including specifications, lifecycle status, sourcing risks, quality checks, and BOM optimization.
Pin-to-Pin Replacement Parts: How to Check Compatibility Before Sourcing
When an original electronic component becomes obsolete, unavailable, or too expensive, a pin-to-pin replacement part can help avoid PCB redesign and keep production or repair projects moving. However, pin-to-pin compatibility does not automatically mean the part is a safe drop-in replacement. This guide explains how to check package, footprint, pinout, electrical ratings, thermal performance, timing behavior, firmware requirements, compliance status, and lifecycle risk before sourcing replacement parts. It also provides a practical checklist to help engineers, buyers, and maintenance teams reduce sourcing mistakes and verify compatibility before purchase.
How to Find Pin-Compatible Alternatives for Obsolete ICs
Finding a pin-compatible alternative for an obsolete IC is not just about matching the package. It requires a structured review of pinout, footprint, electrical parameters, functional behavior, lifecycle status, sourcing reliability, and sample validation.
DDR6 RAM: What We Know So Far About Next-Generation Memory
DDR6 RAM is the next planned generation of DDR memory technology after DDR5, designed to support higher bandwidth, improved efficiency, and future computing platforms with greater data movement requirements. Although DDR6 is not yet a mainstream commercial product, major memory manufacturers and platform developers are already preparing for the next stage of DRAM evolution.