Skip to main content
Volatile and non-volatile storage for every embedded system.

Memory ICs

Memory ICs store data, firmware, and configuration information in electronic systems — from volatile SRAM and DRAM that hold active program data to non-volatile Flash, EEPROM, and FRAM that retain information through power cycles. Octatronics indexes memory ICs from Micron, Samsung, Winbond, Macronix, ISSI, Alliance Memory, Microchip, and Infineon.

Request Quote Browse Base Models
46,139+Products
8Subcategories
10+Manufacturers
100%Original & New
GlobalDelivery

Browse Memory ICs Products

Showing 301–310 of 46,139 products
PART NUMBERMANUFACTURERDESCRIPTIONSTOCKQTY / ACTION
CAT28F512NI-12onsemiPackage: PLCC | Mounting Type: Surface Mount | Supply Voltage: 5 V | Memory Size: 64 kB | Interface: Parallel | Number of Pins: 32104
IDT70V3399S166PRFRenesasPackage: LQFP | Interface: Parallel | Max Operating Temp: 70 °C | Min Operating Temp: 0 °C | Frequency: 166 MHz | Memory Type: RAM, SRAMIn Stock
IDT70125L55JRenesasPackage: LCC | Interface: Parallel | Max Operating Temp: 70 °C | Min Operating Temp: 0 °C | Memory Type: RAM, SRAM | RoHS: Non-CompliantIn Stock
MT42L128M32D1GU-18WTMicron Technology Inc.Supply Voltage: 1.2 V | Clock Rate: 533 MHz | Nominal Supply Voltage Dc: 1.2 V | Density: 4 Gb | Lead Free: Lead Free | Cycle Time: 1.875 nsIn Stock
MT28F008B5VG-8BMicron Technology Inc.Package: Bulk | Interface: Parallel | Max Operating Temp: 70 °C | Min Operating Temp: 0 °C | Lead Free: Contains Lead | Memory Type: FLASH, NORIn Stock
TMS4C2972-26DTTexas InstrumentsPackage / Case: SSOP | Mounting Type: Surface Mount | Lead Free: Contains Lead | Max Operating Temp: 70°C | Min Operating Temp: 0°C | RoHS: No3,010
R1RW0404DGE-2PR#B0RenesasPackage: Bulk | MSL Level: 3 (168 Hours) | Series: * | Reach Status: Vendor Undefined | Lifecycle Status: Active | Programmable: Not VerifiedIn Stock
M29W800AB90M1STMicroelectronicsPackage / Case: SO | Memory Size: 8Mb | Interface: Parallel, I2C, Serial | Access Time: 90ns | Max Operating Temp: 70°C | Min Operating Temp: 0°CIn Stock
EDFP264A2PB-JD-F-RMicron Technology Inc.Package: FBGA | Mounting Type: SMD (SMT) | RoHS: Compliant2,307
ST93CS57B1STMicroelectronicsSupply Voltage: 5V | Memory Size: 2Kb | Interface: MICROWIRE | Access Time: 500ns | Max Frequency: 1MHz | Max Operating Temp: 70°CIn Stock

How to Choose Memory ICs

A practical selection framework for Memory ICs covering specifications, packaging, lifecycle, and sourcing on Octatronics.

  1. Define electrical and environmental requirements

    Start with the required function and operating conditions for Memory ICs, then lock in critical parameters such as function, supply voltage, interface, package, and temperature grade. Match these against datasheet limits, not catalog summaries alone.

  2. Validate package and land pattern compatibility

    Confirm the Memory ICs package matches your PCB footprint, pick-and-place constraints, and moisture sensitivity handling. Verify reel/tape or tube packaging for production.

  3. Check lifecycle, compliance, and alternates

    Review lifecycle status (Active, NRND, EOL), RoHS, and approved alternate sources for Memory ICs before committing to high-volume builds. Use Octatronics cross-reference data when a drop-in replacement is needed.

  4. Compare manufacturers and request pricing

    Filter Memory ICs by manufacturers such as onsemi and ROHM, compare key specs side by side, then submit an RFQ with quantity, target delivery, and traceability requirements.

About Memory ICs

Frequently Asked Questions

Octatronics can help source a wide range of Memory ICs from major manufacturers worldwide, including active production parts, long-lead-time items, and hard-to-find components.

Yes. You can submit a single part number or upload a BOM with multiple parts. Our team will check stock, date code, lead time, and pricing for each item.

Availability depends on the specific part number and supplier source. For important orders, buyers can request packaging photos, labels, date code information, and traceability documents.

Yes. Octatronics supports sourcing for active, end-of-life, obsolete, and hard-to-find components through our global supplier network.

Please provide the part number, manufacturer, quantity, required date code, target price, delivery country, and whether original packaging or COC is required.

Articles & Technology

View All →
How to Choose Electronic Components for Reliable Hardware Design

How to Choose Electronic Components for Reliable Hardware Design

Learn how to choose electronic components for reliable hardware design, including specifications, lifecycle status, sourcing risks, quality checks, and BOM optimization.

Pin-to-Pin Replacement Parts: How to Check Compatibility Before Sourcing

When an original electronic component becomes obsolete, unavailable, or too expensive, a pin-to-pin replacement part can help avoid PCB redesign and keep production or repair projects moving. However, pin-to-pin compatibility does not automatically mean the part is a safe drop-in replacement. This guide explains how to check package, footprint, pinout, electrical ratings, thermal performance, timing behavior, firmware requirements, compliance status, and lifecycle risk before sourcing replacement parts. It also provides a practical checklist to help engineers, buyers, and maintenance teams reduce sourcing mistakes and verify compatibility before purchase.

How to Find Pin-Compatible Alternatives for Obsolete ICs

Finding a pin-compatible alternative for an obsolete IC is not just about matching the package. It requires a structured review of pinout, footprint, electrical parameters, functional behavior, lifecycle status, sourcing reliability, and sample validation.

DDR6 RAM: What We Know So Far About Next-Generation Memory

DDR6 RAM is the next planned generation of DDR memory technology after DDR5, designed to support higher bandwidth, improved efficiency, and future computing platforms with greater data movement requirements. Although DDR6 is not yet a mainstream commercial product, major memory manufacturers and platform developers are already preparing for the next stage of DRAM evolution.