Skip to main content

Flash Memory

Flash memory ICs provide high-density, non-volatile storage for firmware, boot code, data logging, and file systems in embedded systems. This category covers NOR flash (serial SPI/QSPI and parallel) and NAND flash (SLC, MLC, TLC) from Winbond (W25Q), Macronix (MX25), Micron, ISSI, and Microchip (SST). Filter by density, interface speed, voltage, and automotive AEC-Q100 qualification.

Request Quote
12,467+Products
10+Manufacturers
100%Original & New
GlobalDelivery

Browse Flash Memory Products

Showing 81–90 of 12,467 products
PART NUMBERMANUFACTURERDESCRIPTIONSTOCKQTY / ACTION
M29F040-120N1STMicroelectronicsNumber of Pins: 32 | Max Operating Temp: 70 | Min Operating Temp: 0 | Terminal Position: DUAL | Jedec Package Code: R-PDSO-G32 | Width: 8In Stock
S29GL032N90BFI030AInfineon TechnologiesPackage: Bulk | Package / Case: 48-VFBGA | Mounting Type: Surface Mount | Supply Voltage: 2.7V ~ 3.6V | Memory Size: 32Mbit | Operating Temperature: -40°C ~ 85°C (TA)In Stock
W25Q64FVSTIMWinbond ElectronicsPackage: Tube | Package / Case: 8-SOIC (0.209", 5.30mm Width) | Mounting Type: Surface Mount | Supply Voltage: 2.7V ~ 3.6V | Memory Size: 64Mbit | Operating Temperature: -40°C ~ 85°C (TA)2,104
W25Q32FVTCIPWinbond ElectronicsPackage: Tube | Package / Case: 24-TBGA | Mounting Type: Surface Mount | Supply Voltage: 2.7V ~ 3.6V | Memory Size: 32Mbit | Operating Temperature: -40°C ~ 85°C (TA)19,067
M29W008AT120N6TSTMicroelectronicsNumber of Pins: 40 | Max Operating Temp: 85 | Min Operating Temp: -40 | Terminal Position: DUAL | Jedec Package Code: R-PDSO-G40 | Width: 104,480
PF58F0121M0Y0BEAMicron Technology Inc.Package: Tray | MSL Level: 3 (168 Hours) | ECCN: 3A991B1A | HTSUS: 8542.32.0071 | Lifecycle Status: Obsolete | Programmable: Not Verified6,000
S29GL01GP12TFI01Infineon TechnologiesReference Case: TSSOP56 | Reference Date Code: 1451 | Estimated Eol Date: Obsolete / End of life | ECCN: 3A991.b.1.a | Family Name: S29GL01GP | Introduction Date: October 20, 20033,546
S29GL128N11TFA023Infineon TechnologiesPackage: Bulk | Package / Case: 56-TFSOP (0.724", 18.40mm Width) | Mounting Type: Surface Mount | Supply Voltage: 2.7V ~ 3.6V | Memory Size: 128Mbit | Operating Temperature: -40°C ~ 85°C (TA)5,900
M29W128GH70ZS6FMicron Technology Inc.Reference Case: BGA | Reference Date Code: 17+ | Estimated Eol Date: Obsolete / End of life | ECCN: 3A991.b.1.a | Family Name: M29W128GH | Introduction Date: May 05, 20157,820
M28W320HSB70ZA6FMicron Technology Inc.Reference Case: BGA | Reference Date Code: 1439+ | Estimated Eol Date: Obsolete | Family Name: M28W320HSB70ZA6F1,420

How to Choose Flash Memory

A practical selection framework for Flash Memory covering specifications, packaging, lifecycle, and sourcing on Octatronics.

  1. Define electrical and environmental requirements

    Start with the required function and operating conditions for Flash Memory, then lock in critical parameters such as function, supply voltage, interface, package, and temperature grade. Match these against datasheet limits, not catalog summaries alone.

  2. Validate package and land pattern compatibility

    Confirm the Flash Memory package matches your PCB footprint, pick-and-place constraints, and moisture sensitivity handling. Verify reel/tape or tube packaging for production.

  3. Check lifecycle, compliance, and alternates

    Review lifecycle status (Active, NRND, EOL), RoHS, and approved alternate sources for Flash Memory before committing to high-volume builds. Use Octatronics cross-reference data when a drop-in replacement is needed.

  4. Compare manufacturers and request pricing

    Filter Flash Memory by manufacturers such as onsemi and Nexperia, compare key specs side by side, then submit an RFQ with quantity, target delivery, and traceability requirements.

About Flash Memory

Frequently Asked Questions

Octatronics can help source a wide range of Flash Memory from major manufacturers worldwide, including active production parts, long-lead-time items, and hard-to-find components.

Yes. You can submit a single part number or upload a BOM with multiple parts. Our team will check stock, date code, lead time, and pricing for each item.

Availability depends on the specific part number and supplier source. For important orders, buyers can request packaging photos, labels, date code information, and traceability documents.

Yes. Octatronics supports sourcing for active, end-of-life, obsolete, and hard-to-find components through our global supplier network.

Please provide the part number, manufacturer, quantity, required date code, target price, delivery country, and whether original packaging or COC is required.

Articles & Technology

View All →
How to Choose Electronic Components for Reliable Hardware Design

How to Choose Electronic Components for Reliable Hardware Design

Learn how to choose electronic components for reliable hardware design, including specifications, lifecycle status, sourcing risks, quality checks, and BOM optimization.

Pin-to-Pin Replacement Parts: How to Check Compatibility Before Sourcing

When an original electronic component becomes obsolete, unavailable, or too expensive, a pin-to-pin replacement part can help avoid PCB redesign and keep production or repair projects moving. However, pin-to-pin compatibility does not automatically mean the part is a safe drop-in replacement. This guide explains how to check package, footprint, pinout, electrical ratings, thermal performance, timing behavior, firmware requirements, compliance status, and lifecycle risk before sourcing replacement parts. It also provides a practical checklist to help engineers, buyers, and maintenance teams reduce sourcing mistakes and verify compatibility before purchase.

How to Find Pin-Compatible Alternatives for Obsolete ICs

Finding a pin-compatible alternative for an obsolete IC is not just about matching the package. It requires a structured review of pinout, footprint, electrical parameters, functional behavior, lifecycle status, sourcing reliability, and sample validation.

DDR6 RAM: What We Know So Far About Next-Generation Memory

DDR6 RAM is the next planned generation of DDR memory technology after DDR5, designed to support higher bandwidth, improved efficiency, and future computing platforms with greater data movement requirements. Although DDR6 is not yet a mainstream commercial product, major memory manufacturers and platform developers are already preparing for the next stage of DRAM evolution.