Skip to main content

Configuration PROMs for FPGAs

Configuration PROMs store FPGA bitstream data for automatic device configuration at power-up. These non-volatile memories ensure FPGAs load their programmed logic immediately when powered on. Available from AMD/Xilinx, Intel/Altera, and Lattice.

Request Quote
282+Products
3+Manufacturers
100%Original & New
GlobalDelivery

Product Series & Base Models

Navigate by model series to compare ordering variants and technical specifications within the Configuration PROMs for FPGAs family.

Browse Configuration PROMs for FPGAs Products

Showing 21–30 of 282 products
PART NUMBERMANUFACTURERDESCRIPTIONSTOCKQTY / ACTION
AT17N010-10SCMicrochip Technology1,591
AT17N040-10TQCMicrochip Technology51
AT17N010-10SIMicrochip Technology2,161
AT17N010-10PIMicrochip Technology41,812
AT17N010-10PCMicrochip Technology1,337
AT17N002-10TQIMicrochip Technology1,003
AT17N002-10TQCMicrochip Technology25
AT17N002-10SIMicrochip Technology2,167
AT17LV512A-10JUMicrochip Technology1,568
AT17LV512A-10PUMicrochip Technology7,224

About Configuration PROMs for FPGAs

Configuration PROMs for FPGAs are dedicated, highly reliable non-volatile memory devices designed to store the proprietary firmware bitstream of a Field Programmable Gate Array (FPGA) and automatically load it into the FPGA's volatile SRAM cells immediately upon system power-up. These configuration memories ensure that FPGAs achieve instant-on functionality, protecting system boot paths in critical telecom and aerospace hardware.

Key selection parameters include memory capacity (density, ranging from megabits to gigabits to match the target FPGA logic size), read speed (MHz), configuration interface compatibility (Active Serial, Passive Serial, SPI, BPI, SelectMAP), operating voltage, and small footprint packages. High-reliability models include integrated security features to prevent bitstream copying and unauthorized tampering.

Browse and compare FPGA configuration PROMs on Octatronics from leading FPGA manufacturers including AMD/Xilinx, Intel/Altera, and Lattice Semiconductor. Access datasheets, footprint details, and submit bulk RFQs online.

Frequently Asked Questions

Octatronics can help source a wide range of Configuration PROMs for FPGAs from major manufacturers worldwide, including active production parts, long-lead-time items, and hard-to-find components.

Yes. You can submit a single part number or upload a BOM with multiple parts. Our team will check stock, date code, lead time, and pricing for each item.

Availability depends on the specific part number and supplier source. For important orders, buyers can request packaging photos, labels, date code information, and traceability documents.

Yes. Octatronics supports sourcing for active, end-of-life, obsolete, and hard-to-find components through our global supplier network.

Please provide the part number, manufacturer, quantity, required date code, target price, delivery country, and whether original packaging or COC is required.

Articles & Technology

View All →

Top Semiconductor Companies in 2026: Manufacturers, Foundries, Fabless Firms and IDMs

NVIDIA led semiconductor vendor revenue in 2025, while TSMC dominated pure-play foundry sales. This guide explains why those rankings measure different things—and gives engineers and buyers a practical framework for selecting manufacturers by component category, lifecycle, qualification, and supply risk.

2026-08-11
DDR4 vs DDR5: Key Differences in Speed, Latency, Power, Capacity, and Compatibility

DDR4 vs DDR5: Key Differences in Speed, Latency, Power, Capacity, and Compatibility

DDR5 is the newer memory standard, offering higher bandwidth, lower nominal operating voltage, improved module architecture, and better capacity scaling than DDR4. However, DDR4 remains widely used in existing PCs, embedded systems, industrial equipment, and cost-sensitive platforms. The best choice depends on your motherboard, processor, workload, budget, and long-term sourcing requirements.

2026-07-02
Circuit Board Component Identification: How to Identify PCB Components by Markings, Shape, and Codes

Circuit Board Component Identification: How to Identify PCB Components by Markings, Shape, and Codes

Circuit board component identification means recognizing PCB parts by their reference designators, physical appearance, body markings, polarity marks, package type, and electrical function. The fastest way to identify a component is to start with the PCB silkscreen, match the reference letter to a component type, inspect its shape and package, read any value or top marking, then confirm the result with a datasheet, schematic, BOM, or measurement tool. This guide explains how to identify common PCB components such as resistors, capacitors, inductors, diodes, transistors, MOSFETs, ICs, connectors, fuses, relays, crystals, and test points. It also includes practical examples, common marking codes, polarity clues, mistakes to avoid, and a replacement sourcing checklist.

2026-06-28
IC Top Marking Codes Explained: How to Identify SMD Chips from Package Markings

IC Top Marking Codes Explained: How to Identify SMD Chips from Package Markings

IC top marking codes are abbreviated package markings used to identify semiconductor devices, especially small SMD chips that cannot fit a full part number. Buyers should use the marking as a starting point, then verify manufacturer logo, package, pin count, date code, lot code, datasheet, packing label, and supplier documentation. Official manufacturer marking tools and datasheets should be used before relying on third-party SMD code databases.

2026-06-24
DDR6 RAM: What We Know So Far About Next-Generation Memory

DDR6 RAM: What We Know So Far About Next-Generation Memory

DDR6 RAM is the next planned generation of DDR memory technology after DDR5, designed to support higher bandwidth, improved efficiency, and future computing platforms with greater data movement requirements. Although DDR6 is not yet a mainstream commercial product, major memory manufacturers and platform developers are already preparing for the next stage of DRAM evolution.

2026-06-11
How to Find Pin-Compatible Alternatives for Obsolete ICs

How to Find Pin-Compatible Alternatives for Obsolete ICs

Finding a pin-compatible alternative for an obsolete IC is not just about matching the package. It requires a structured review of pinout, footprint, electrical parameters, functional behavior, lifecycle status, sourcing reliability, and sample validation.

2026-06-08
Pin-to-Pin Replacement Parts: How to Check Compatibility Before Sourcing

Pin-to-Pin Replacement Parts: How to Check Compatibility Before Sourcing

When an original electronic component becomes obsolete, unavailable, or too expensive, a pin-to-pin replacement part can help avoid PCB redesign and keep production or repair projects moving. However, pin-to-pin compatibility does not automatically mean the part is a safe drop-in replacement. This guide explains how to check package, footprint, pinout, electrical ratings, thermal performance, timing behavior, firmware requirements, compliance status, and lifecycle risk before sourcing replacement parts. It also provides a practical checklist to help engineers, buyers, and maintenance teams reduce sourcing mistakes and verify compatibility before purchase.

2026-06-02
How to Choose Electronic Components for Reliable Hardware Design

How to Choose Electronic Components for Reliable Hardware Design

Learn how to choose electronic components for reliable hardware design, including specifications, lifecycle status, sourcing risks, quality checks, and BOM optimization.

2026-04-30