Winbond Electronics W988D6FBGX7I DRAM
IC DRAM 256MBIT LVCMOS 54VFBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W988D6FBGX7I
Detailed Description
Package
54-VFBGA (8x9)
Key Features
Package: Tray; Package / Case: 54-TFBGA; Mounting Type: Surface Mount; Supply Voltage: 1.7V ~ 1.95V; Memory Size: 256Mbit
Lifecycle Status
Obsolete
RoHS State
Unknown
Datasheet
W988D6FBGX7I Datasheet
Quick Jump:
Technical Specifications
Winbond Electronics W988D6FBGX7I DRAM technical specifications.
General
Max Frequency
133 MHz
Operating Temperature
-40°C ~ 85°C (TC)
Memory Interface
LVCMOS
Memory Organization
16M x 16
Mounting Type
Surface Mount
Memory Type
Volatile
Lifecycle Status
Obsolete
Supplier Device Package
54-VFBGA (8x9)
Access Time
5.4 ns
Write Cycle Time Word Page
15ns
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W988D6FBGX6IWinbond ElectronicsPackage: Tray | Package / Case: 54-TFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.7V ~ 1.95V | Memory Size: 256Mbit | Operating Temperature: -40°C ~ 85°C (TA)
W987D6HBGX6IWinbond ElectronicsPackage: Tray | Package / Case: 54-TFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.7V ~ 1.95V | Memory Size: 128Mbit | Operating Temperature: -40°C ~ 85°C (TA)
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