Winbond Electronics W987D6HBGX7E DRAM
IC DRAM 128MBIT PAR 54VFBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W987D6HBGX7E
Detailed Description
Package
54-VFBGA (8x9)
Key Features
Package: Tray; Package / Case: 54-TFBGA; Mounting Type: Surface Mount; Supply Voltage: 1.7V ~ 1.95V; Memory Size: 128Mbit
Lifecycle Status
Obsolete
RoHS State
Compliant
Datasheet
W987D6HBGX7E Datasheet
Quick Jump:
Technical Specifications
Winbond Electronics W987D6HBGX7E DRAM technical specifications.
General
Max Frequency
133 MHz
Memory Type
Volatile
Lifecycle Status
Obsolete
Supplier Device Package
54-VFBGA (8x9)
Access Time
5.4 ns
Package / Case
54-TFBGA
Technology
SDRAM - Mobile LPSDR
Supply Voltage
1.7V ~ 1.95V
Reach Status
REACH Unaffected
Mfr
Winbond Electronics
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W987D6HBGX6IWinbond ElectronicsPackage: Tray | Package / Case: 54-TFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.7V ~ 1.95V | Memory Size: 128Mbit | Operating Temperature: -40°C ~ 85°C (TA)