Winbond Electronics W987D2HBJX6E DRAM
IC DRAM 128MBIT PAR 90VFBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W987D2HBJX6E
Detailed Description
Package
90-VFBGA (8x13)
Key Features
Package: Tray; Package / Case: 90-TFBGA; Mounting Type: Surface Mount; Supply Voltage: 1.7V ~ 1.95V; Memory Size: 128Mbit
Lifecycle Status
Obsolete
RoHS State
Unknown
Datasheet
W987D2HBJX6E Datasheet
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Technical Specifications
Winbond Electronics W987D2HBJX6E DRAM technical specifications.
General
MSL Level
3 (168 Hours)
Inventory Source
Winsource
Inventory Source File
/Volumes/T7 Shield/电子元器件数据/抓取的数据/Win-Source数据/winsource_未曾下架数据_202605_1.xlsx
Inventory As of
2026-05-15
Source Manufacturer
Winbond Electronics
Source Category
Integrated Circuits (ICs) > Memory
Stock
2374
Extracted Price
20.4239
Price Formula
winsource min price * 2
Max Frequency
166 MHz
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W988D2FBJX6EWinbond ElectronicsPackage: Tray | Package / Case: 90-TFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.7V ~ 1.95V | Memory Size: 256Mbit | Operating Temperature: -25°C ~ 85°C (TC)
W987D2HBJX6IWinbond ElectronicsPackage: Tray | Package / Case: 90-TFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.7V ~ 1.95V | Memory Size: 128Mbit | Operating Temperature: -40°C ~ 85°C (TA)
W947D2HBJX5EWinbond ElectronicsPackage: Tray | Package / Case: 90-TFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.7V ~ 1.95V | Memory Size: 128Mbit | Operating Temperature: -25°C ~ 85°C (TC)