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Winbond Electronics W74M25JWZEIQ Memory ICs

SECURITY AUTHENTICATION SPIFLASH

540 ActiveWinbond ElectronicsW74M8-WDFN Exposed Pad$8.69
W74M25JWZEIQ - No Image Available

Same model may have multiple batches, images only for reference.

W74M25JWZEIQ
Part Number (MPN)
W74M25JWZEIQ
Base Model
Detailed Description
SECURITY AUTHENTICATION SPIFLASH
Package
8-WDFN Exposed Pad
Lifecycle Status
Active
Datasheet
PDF W74M25JWZEIQ Datasheet
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Ordering Code Family

W74M groups multiple orderable suffixes under one base device. Compare package, grade, and reel options on the base-number page before substituting within the family.

2 ordering variants listed on the family page.

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Technical Specifications

Winbond Electronics W74M25JWZEIQ Memory ICs technical specifications.

General

Memory Size
256Mb (32M x 8)
RoHS
Compliant
Number of Pins
8
Package / Case
8-WDFN Exposed Pad
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C
Supply Voltage
1.7V ~ 1.95V
Lifecycle Status
Active
Package
8-WDFN Exposed Pad
Technology
FLASH - NAND

Alternate Parts Comparison (W74M25JWZEIQ vs W74M00AVSNIG vs W74M12JVSSIQ vs W74M12JWZEIQ)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case8-WDFN Exposed Pad8-SOIC8-SOIC8-WDFN Exposed Pad
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 85°C-40°C ~ 85°C-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)
Supply Voltage1.7V ~ 1.95V2.7V ~ 3.6V2.7V ~ 3.6V1.7V ~ 1.95V
RoHSCompliantROHS3 CompliantROHS3 CompliantROHS3 Compliant
Lifecycle StatusActiveActiveActiveActive
Max Frequency104 MHz80 MHz133 MHz104 MHz
Memory FormatFlashFLASHFLASHFLASH
Memory TypeNon-VolatileNon-VolatileNon-VolatileNon-Volatile
TechnologyFLASH - NANDFLASH - NANDFLASH - NANDFLASH - NAND
Memory Size256Mb (32M x 8)--128 Mbit128 Mbit
Series--W74M00AVSpiFlash®SpiFlash®
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