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Winbond Electronics W74M12JWSSIQ Memory ICs

IC FLASH 128MBIT 104MHZ 8SOIC

10 ActiveWinbond ElectronicsW74M8-SOIC (0.209", 5.30mm Width)$13.29RoHS
W74M12JWSSIQ - No Image Available

Same model may have multiple batches, images only for reference.

W74M12JWSSIQ
Part Number (MPN)
W74M12JWSSIQ
Base Model
Detailed Description
Package
8-SOIC (0.209", 5.30mm Width)
Key Features
Package: 8-SOIC (0.209", 5.30mm Width); Supply Voltage: 1.7V ~ 1.95V; Memory Size: 128Mb (16M x 8)
Lifecycle Status
Active
RoHS State
Unknown
Datasheet
PDF W74M12JWSSIQ Datasheet
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Ordering Code Family

W74M groups multiple orderable suffixes under one base device. Compare package, grade, and reel options on the base-number page before substituting within the family.

2 ordering variants listed on the family page.

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Technical Specifications

Winbond Electronics W74M12JWSSIQ Memory ICs technical specifications.

General

Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package
8-SOIC (0.209", 5.30mm Width)
Technology
FLASH - NAND
Supplier Device Package
8-SOIC
Memory Size
128Mb (16M x 8)
Memory Type
Non-Volatile
Supply Voltage
1.7V ~ 1.95V
Max Frequency
104 MHz
Memory Format
Flash

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Package: SON | Package / Case: 8-WDFN Exposed Pad | Mounting Type: Surface Mount | Supply Voltage: 3/3.3 | Memory Size: 128M | Interface: Serial (SPI, Dual SPI, Quad SPI) | Operating Temperature: -40°C ~ 85°C (TA) | Number of Pins: 8
W74M12JVSSIQW74M12JVSSIQWinbond Electronics
Package: Tube | Package / Case: 8-SOIC (0.209", 5.30mm Width) | Mounting Type: Surface Mount | Supply Voltage: 2.7V ~ 3.6V | Memory Size: 128Mbit | Interface: SPI | Operating Temperature: -40°C ~ 85°C (TA)