Winbond Electronics W66CP2NQQAHJ DRAM
4GB LPDDR4, DDP, X32, 2133MHZ, -
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W66CP2NQQAHJ
Detailed Description
4GB LPDDR4, DDP, X32, 2133MHZ, -
Package
TFBGA
Key Features
Mounting Type: Surface Mount
Lifecycle Status
Last Time Buy
RoHS State
RoHS Compliant
Datasheet
W66CP2NQQAHJ Datasheet
Quick Jump:
Technical Specifications
Winbond Electronics W66CP2NQQAHJ DRAM technical specifications.
General
RoHS
Compliant
Number of Pins
200
Mounting Type
Surface Mount
Lifecycle Status
LTB
Automotive
No
Ppap
No
Package Height
0.72
Package Width
10
Package Length
14.5
Supplier Package
TFBGA
Alternate Parts Comparison (W66CP2NQQAHJ vs W631GG8NB-12 TR vs W94AD6KBHX5E TR vs W949D2KBJX5I)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | SMD (SMT) |
| RoHS | Compliant | -- | -- | Compliant |
| Number of Pins | 200 | -- | -- | -- |
| Lifecycle Status | LTB | -- | -- | -- |
| Automotive | No | -- | -- | -- |
| Package Height | 0.72 | -- | -- | -- |
| Package Length | 14.5 | -- | -- | -- |
| Package Width | 10 | -- | -- | -- |
| Ppap | No | -- | -- | -- |
| Supplier Package | TFBGA | -- | -- | -- |
| Operating Temperature | -- | 0°C ~ 95°C (TC) | -25°C ~ 85°C (TC) | -40 °C ~ 85 °C |
| Memory Type | -- | Volatile | Volatile | LPDDR, RAM, SDRAM |
| Action |
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