Winbond Electronics W632GU6NB11I Memory ICs
IC DRAM 2GBIT PARALLEL 96VFBGA

Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W632GU6NB11I
Base Model
Detailed Description
Package
96-VFBGA
Key Features
Package: 96-VFBGA; Supply Voltage: 1.283V ~ 1.45V; Memory Size: 2Gb (128M x 16)
Lifecycle Status
Active
RoHS State
Unknown
Datasheet
W632GU6NB11I Datasheet
Quick Jump:
Technical Specifications
Winbond Electronics W632GU6NB11I Memory ICs technical specifications.
General
Operating Temperature
-40°C ~ 95°C (TC)
Mounting Type
Surface Mount
Package
96-VFBGA
Technology
SDRAM - DDR3L
Supplier Device Package
96-VFBGA (7.5x13)
Memory Size
2Gb (128M x 16)
Memory Type
Volatile
Supply Voltage
1.283V ~ 1.45V
Max Frequency
933 MHz
Access Time
20 ns
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W632GU6QB-09Winbond ElectronicsPackage: Tray | Package / Case: 96-VFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.283V ~ 1.45V | Memory Size: 2Gbit | Operating Temperature: 0°C ~ 95°C (TC) | Organization: 128 M x 16
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W632GU6KB12IWinbond ElectronicsPackage: Tray | Package / Case: 96-TFBGA | Mounting Type: Surface Mount | Supply Voltage: 1.283V ~ 1.45V | Memory Size: 2Gbit | Operating Temperature: -40°C ~ 95°C (TC)