Winbond Electronics W29N08GVBIAA Memory ICs
4G-BIT NAND FLASH, 3V X 8BIT
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W29N08GVBIAA
Base Model
Detailed Description
Package
63-VFBGA
Key Features
Package: 63-VFBGA; Supply Voltage: 2.7V ~ 3.6V; Memory Size: 8Gb (1G x 8)
Lifecycle Status
Active
RoHS State
Unknown
Datasheet
W29N08GVBIAA Datasheet
Quick Jump:
Technical Specifications
Winbond Electronics W29N08GVBIAA Memory ICs technical specifications.
General
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package
63-VFBGA
Technology
FLASH - NAND (SLC)
Supplier Device Package
63-VFBGA (9x11)
Memory Size
8Gb (1G x 8)
Memory Type
Non-Volatile
Supply Voltage
2.7V ~ 3.6V
Max Frequency
40 MHz
Access Time
25 ns
More in This Category
Browse related parts from the same category — sorted by series, manufacturer, and package similarity. These are not verified pin-to-pin substitutes.
W29N02GZBIBFWinbond ElectronicsOperating Temperature: -40°C ~ 85°C (TA) Memory Interface: Parallel Memory Organization: 256M x 8 Mounting Type: Surface Mount Memory Type: Non-Volatile Product Status: Active Supplier Device Package: 63-VFBGA (9x11) Access Time: 25 ns Write Cycle Time | Word Page: 35ns Memory Size: 2Gbit Package / Case: 63-VFBGA Technology: FLASH | Supply: 1.7V ~ 1.95V Package: Tray Memory Format: FLASH | Inventory As of: 2026-05-14 | Source Manufacturer: Winbond Electronics
W29N01GVSIAAWinbond ElectronicsPackage: Tray | Package / Case: 48-TFSOP (0.724", 18.40mm Width) | Mounting Type: Surface Mount | Supply Voltage: 2.7V ~ 3.6V | Memory Size: 1Gbit | Operating Temperature: -40°C ~ 85°C (TA)
W29N01GVDIAAWinbond ElectronicsPackage: Tray | Package / Case: 48-VFBGA | Mounting Type: Surface Mount | Supply Voltage: 2.7V ~ 3.6V | Memory Size: 1Gbit | Operating Temperature: -40°C ~ 85°C (TA)