Winbond Electronics W29N02GVSIAA Memory ICs
IC FLASH 2GBIT PARALLEL 48TSOP

Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W29N02GVSIAA
Base Model
Detailed Description
Package
48-TFSOP (0.724", 18.40mm Width)
Key Features
Package: 48-TFSOP (0.724", 18.40mm Width); Supply Voltage: 2.7V ~ 3.6V; Memory Size: 2Gb (256M x 8)
Lifecycle Status
Active
RoHS State
Unknown
Datasheet
W29N02GVSIAA Datasheet
Quick Jump:
Technical Specifications
Winbond Electronics W29N02GVSIAA Memory ICs technical specifications.
General
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package
48-TFSOP (0.724", 18.40mm Width)
Technology
FLASH - NAND (SLC)
Supplier Device Package
48-TSOP
Memory Size
2Gb (256M x 8)
Memory Type
Non-Volatile
Supply Voltage
2.7V ~ 3.6V
Access Time
25 ns
Memory Format
Flash
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W29N02GZBIBFWinbond ElectronicsOperating Temperature: -40°C ~ 85°C (TA) Memory Interface: Parallel Memory Organization: 256M x 8 Mounting Type: Surface Mount Memory Type: Non-Volatile Product Status: Active Supplier Device Package: 63-VFBGA (9x11) Access Time: 25 ns Write Cycle Time | Word Page: 35ns Memory Size: 2Gbit Package / Case: 63-VFBGA Technology: FLASH | Supply: 1.7V ~ 1.95V Package: Tray Memory Format: FLASH | Inventory As of: 2026-05-14 | Source Manufacturer: Winbond Electronics
Package: Tray | Package / Case: 48-TFSOP (0.724", 18.40mm Width) | Mounting Type: Surface Mount | Supply Voltage: 2.7V ~ 3.6V | Memory Size: 1Gbit | Operating Temperature: -40°C ~ 85°C (TA)
W29N01GVDIAAWinbond ElectronicsPackage: Tray | Package / Case: 48-VFBGA | Mounting Type: Surface Mount | Supply Voltage: 2.7V ~ 3.6V | Memory Size: 1Gbit | Operating Temperature: -40°C ~ 85°C (TA)