Winbond Electronics W29N02GVBIAA Memory ICs
IC FLASH 2GBIT PARALLEL 63FBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W29N02GVBIAA
Base Model
Detailed Description
Package
63-VFBGA
Key Features
Package: 63-VFBGA; Supply Voltage: 2.7V ~ 3.6V; Memory Size: 2Gb (256M x 8)
Lifecycle Status
Active
RoHS State
Unknown
Datasheet
W29N02GVBIAA Datasheet
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Technical Specifications
Winbond Electronics W29N02GVBIAA Memory ICs technical specifications.
General
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package
63-VFBGA
Technology
FLASH - NAND (SLC)
Supplier Device Package
63-FBGA (11x9)
Memory Size
2Gb (256M x 8)
Memory Type
Non-Volatile
Supply Voltage
2.7V ~ 3.6V
Access Time
25 ns
Memory Format
Flash
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W29N02GZBIBFWinbond ElectronicsOperating Temperature: -40°C ~ 85°C (TA) Memory Interface: Parallel Memory Organization: 256M x 8 Mounting Type: Surface Mount Memory Type: Non-Volatile Product Status: Active Supplier Device Package: 63-VFBGA (9x11) Access Time: 25 ns Write Cycle Time | Word Page: 35ns Memory Size: 2Gbit Package / Case: 63-VFBGA Technology: FLASH | Supply: 1.7V ~ 1.95V Package: Tray Memory Format: FLASH | Inventory As of: 2026-05-14 | Source Manufacturer: Winbond Electronics
W29N01GVSIAAWinbond ElectronicsPackage: Tray | Package / Case: 48-TFSOP (0.724", 18.40mm Width) | Mounting Type: Surface Mount | Supply Voltage: 2.7V ~ 3.6V | Memory Size: 1Gbit | Operating Temperature: -40°C ~ 85°C (TA)
W29N01GVDIAAWinbond ElectronicsPackage: Tray | Package / Case: 48-VFBGA | Mounting Type: Surface Mount | Supply Voltage: 2.7V ~ 3.6V | Memory Size: 1Gbit | Operating Temperature: -40°C ~ 85°C (TA)