Winbond Electronics W25Q256JWBIQ TR Memory ICs
IC FLASH 256MBIT SPI 24TFBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W25Q256JWBIQ TR
Detailed Description
Package
24-TBGA
Key Features
Package / Case: 24-TBGA; Supplier Device Package: 24-TFBGA (6x8); Voltage - Supply: 1.7V ~ 1.95V; Interface: SPI - Quad I/O; Memory Size: 256Mbit; Technology: FLASH - NOR
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
W25Q256JWBIQ TR Datasheet
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Technical Specifications
Winbond Electronics W25Q256JWBIQ TR Memory ICs technical specifications.
General
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
24-TBGA
Technology
FLASH - NOR
Supplier Device Package
24-TFBGA (6x8)
Memory Size
256Mbit
Memory Type
Non-Volatile
Supply Voltage
1.7V ~ 1.95V
Max Frequency
133 MHz
Access Time
6 ns
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