Winbond Electronics W25N01GVTBIG Memory ICs
IC FLASH 1GBIT SPI/QUAD 24TFBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W25N01GVTBIG
Series
Detailed Description
Package
24-TBGA
Key Features
Package / Case: 24-TBGA; Supplier Device Package: 24-TFBGA (8x6); Voltage - Supply: 2.7V ~ 3.6V; Interface: SPI - Quad I/O; Memory Size: 1Gbit; Technology: FLASH - NAND (SLC)
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
W25N01GVTBIG Datasheet
Quick Jump:
Technical Specifications
Winbond Electronics W25N01GVTBIG Memory ICs technical specifications.
General
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
24-TBGA
Technology
FLASH - NAND (SLC)
Supplier Device Package
24-TFBGA (8x6)
Memory Size
1Gbit
Memory Type
Non-Volatile
Supply Voltage
2.7V ~ 3.6V
Max Frequency
104 MHz
Access Time
7 ns
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