Winbond Electronics W25Q128FVCIG Flash Memory
IC FLASH 128MBIT SPI 24TFBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
W25Q128FVCIG
Series
Detailed Description
IC FLASH 128MBIT SPI 24TFBGA
Package
24-TFBGA (6x8)
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
W25Q128FVCIG Datasheet
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Technical Specifications
Winbond Electronics W25Q128FVCIG Flash Memory technical specifications.
General
Max Frequency
104 MHz
Operating Temperature
-40°C ~ 85°C (TA)
Memory Interface
SPI - Quad I/O, QPI
Memory Organization
16M x 8
Mounting Type
Surface Mount
Memory Type
Non-Volatile
Lifecycle Status
Discontinued at Digi-Key
Supplier Device Package
24-TFBGA (6x8)
Series
SpiFlash®
Write Cycle Time Word Page
50µs, 3ms
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W25Q128JVSIQTRWinbond ElectronicsPackage: Reel | Package / Case: SOIC-8 | Memory Size: 128 Mbit | Interface: SPI | Organization: 16 M x 8
W25Q128FVPIQWinbond ElectronicsPackage: Tube | Package / Case: 8-WDFN Exposed Pad | Mounting Type: Surface Mount | Supply Voltage: 2.7V ~ 3.6V | Memory Size: 128Mbit | Operating Temperature: -40°C ~ 85°C (TA)