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Winbond Electronics W25N04KVZEIR Memory ICs

4G-BIT SERIAL NAND FLASH, 3V

1,740 ActiveWinbond ElectronicsSpiFlash®W25N8-WDFN Exposed Pad$28.14
W25N04KVZEIR - No Image Available

Same model may have multiple batches, images only for reference.

W25N04KVZEIR
Part Number (MPN)
W25N04KVZEIR
Base Model
Detailed Description
4G-BIT SERIAL NAND FLASH, 3V
Package
8-WDFN Exposed Pad
Lifecycle Status
Active
Datasheet
PDF W25N04KVZEIR Datasheet
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Ordering Code Family

W25N groups multiple orderable suffixes under one base device. Compare package, grade, and reel options on the base-number page before substituting within the family.

4 ordering variants listed on the family page.

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Technical Specifications

Winbond Electronics W25N04KVZEIR Memory ICs technical specifications.

General

Interface
Serial (SPI, Dual SPI, Quad SPI)
Memory Size
4Gb (512M x 8)
RoHS
Compliant
Number of Pins
8
Package / Case
8-WDFN Exposed Pad
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C
Supply Voltage
2.7V ~ 3.6V
Lifecycle Status
Active
Package
8-WDFN Exposed Pad

Alternate Parts Comparison (W25N04KVZEIR vs W25N04KVSFIU vs W25N01JWTBIT vs W25N02KWZEIR)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case8-WDFN Exposed Pad16-SOIC24-TBGA8-WDFN Exposed Pad
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 85°C-40°C ~ 85°C-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)
Supply Voltage2.7V ~ 3.6V2.7V ~ 3.6V1.7V ~ 1.95V1.7V ~ 1.95V
Memory Size4Gb (512M x 8)4Gbit1Gbit2Gbit
RoHSCompliantROHS3 CompliantROHS3 CompliantROHS3 Compliant
Lifecycle StatusActiveActiveActiveActive
Max Frequency104 MHz104 MHz166 MHz104 MHz
Memory FormatFlashFLASHFLASHFlash
Memory InterfaceSPI - Quad I/OSPI - Quad I/OSPI - Quad I/O, DTRSPI - Quad I/O
Memory TypeNon-VolatileNon-VolatileNon-VolatileNon-Volatile
TechnologyFLASH - NANDFLASH - NANDFLASH - NAND (SLC)FLASH - NAND (SLC)
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