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Winbond Electronics W25N04KVTBIR Flash Memory

IC FLASH 4GBIT SPI/QUAD 24TFBGA

In Stock ActiveWinbond ElectronicsSpiFlash®BGARoHS
W25N04KVTBIR - No Image Available

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W25N04KVTBIR
Part Number (MPN)
W25N04KVTBIR
Detailed Description
IC FLASH 4GBIT SPI/QUAD 24TFBGA
Package
BGA
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF W25N04KVTBIR Datasheet
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Technical Specifications

Winbond Electronics W25N04KVTBIR Flash Memory technical specifications.

General

Memory Size
4Gb (512M x 8)
RoHS
Compliant
Number of Pins
24
Package / Case
24-TBGA
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C
Supply Voltage
2.7V ~ 3.6V
Lifecycle Status
Active
Package Height
0.85
Package Width
6

Alternate Parts Comparison (W25N04KVTBIR vs W25Q128JVSIQTR vs W25Q128JVFIQ TR vs W25Q128JWPIM TR)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case24-TBGASOIC-816-SOIC8-WDFN Exposed Pad
Mounting TypeSurface MountSMD/SMTSurface MountSurface Mount
Operating Temperature-40°C ~ 85°C- 40°C ~ + 85°C-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)
Supply Voltage2.7V ~ 3.6V2.7 V ~ 3.6 V2.7V ~ 3.6V1.7V ~ 1.95V
Memory Size4Gb (512M x 8)128 Mbit128 Mbit128 Mbit
Max Frequency104 MHz--133 MHz133 MHz
Memory FormatFlash--FlashFlash
Memory InterfaceSPI - Quad I/O--SPI - Quad I/O, QPI, DTRSPI - Quad I/O
Memory TypeNon-Volatile--Non-VolatileNon-Volatile
TechnologyFLASH - NAND--FLASH - NORFLASH - NOR
Write Cycle Time Word Page250µs--3ms-, 3ms
Series--W25Q128JVSpiFlash®SpiFlash®
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