NXP Semiconductors S9S12DG12F1CPVER Microcontroller, Microprocessor, FPGA Modules
IC MCU 16BIT 128KB FLASH 112LQFP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
S9S12DG12F1CPVER
Detailed Description
IC MCU 16BIT 128KB FLASH 112LQFP
Package
112-LQFP
Key Features
Package / Case: 112-LQFP; Mounting Type: Surface Mount
Lifecycle Status
NRND
RoHS State
RoHS Compliant
Datasheet
S9S12DG12F1CPVER Datasheet
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Technical Specifications
NXP Semiconductors S9S12DG12F1CPVER Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
RAM Size
8K x 8
Package / Case
112-LQFP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
2.35V ~ 5.25V
Peripherals
PWM, WDT
Number of I/O
91
Speed
25MHz
EEPROM Size
2K x 8
Core Processor
HCS12
Alternate Parts Comparison (S9S12DG12F1CPVER vs S912XEG128BCAL vs S912XEP100J4MAL vs MC9S12B128CPVE)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 112-LQFP | 112-LQFP | 112-LQFP | 112-LQFP |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 125°C (TA) | -40°C ~ 85°C (TA) |
| Supply Voltage | 2.35V ~ 5.25V | 1.72V ~ 5.5V | 1.72V ~ 5.5V | 2.35V ~ 5.5V |
| Core Processor | HCS12 | HCS12X | HCS12X | HCS12 |
| Core Size | 16-Bit | 16-Bit | 16-Bit | 16-Bit |
| RAM Size | 8K x 8 | 12K x 8 | 64K x 8 | 4K x 8 |
| Connectivity | CANbus, I²C, SCI, SPI | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | CANbus, I²C, SCI, SPI |
| Data Converters | A/D 16x10b | A/D 16x12b | A/D 16x12b | A/D 16x10b |
| EEPROM Size | 2K x 8 | 2K x 8 | 4K x 8 | 1K x 8 |
| Number of I/O | 91 | 91 | 91 | 91 |
| Oscillator Type | Internal | External | External | Internal |
| Action |
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